Shenzhen World Exhibition & Convention Center (Bao'an) | September 9-11, 2026
215 Days to Go
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ABF载板

半导体展:Chiplet生态链,SiP系统级封装,CoWoS/TSV/2.5D/3D/FOPLP/RDL
半导体封装载板（集成电路基板）主要用于连接高度复杂的微芯片与印制电路板，承载存储器、电源供应及其他关键系统组件。
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Tel: +86 755 8831 1422

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