Shenzhen World Exhibition & Convention Center (Bao'an) | September 9-11, 2026
214 Days to Go
CN
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首款打通RMT全流程，搭载HBM3全国产2.5D AI芯片

半导体展:SiP系统级封装
封装类型：HFCBGA-2.5D-SiP
封装尺寸：31 x 31mm²
HBM3/E
HBM I/O：9.6Gbps
12nm，全国产化
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